Optical Surface Profiler Guide: WLI vs Point Confocal vs Focus Variation | POMEAS Optical Surface Profiler Guide: WLI vs Point Confocal vs Focus Variation | POMEAS

Optical Surface Profiler Guide: WLI vs Point Confocal vs Focus Variation | POMEAS

Optical surface profiler guide: WLI vs point confocal vs focus variation, PSI/VSI mode selection and WLI100 specs for 3D topography and roughness.

PCB AOI Lens Upgrade: 17.3 mm to 12 mm or 8 mm FOV PCB AOI Lens Upgrade: 17.3 mm to 12 mm or 8 mm FOV

PCB AOI Lens Upgrade: 17.3 mm to 12 mm or 8 mm FOV

Keep your AOI camera and light, shrink the field of view from 17.3 x 17.3 mm to 12 x 12 or 8 x 8 mm. The magnification maths, lens routes and WD cost.

Optical Metrology OEM Modules: Design-to-Production Verification Checklist Optical Metrology OEM Modules: Design-to-Production Verification Checklist

Optical Metrology OEM Modules: Design-to-Production Verification Checklist

A six-gate qualification path for optical metrology modules, from optical feasibility to change control, with the specification fields that actually transfer.

Robotic At-Line Metrology: When to Add a Camera-Based Optical Station Robotic At-Line Metrology: When to Add a Camera-Based Optical Station

Robotic At-Line Metrology: When to Add a Camera-Based Optical Station

When a camera optical station earns its place beside a robot arm: uncertainty budget, depth of field, cycle time and interface ownership.

HBM and WLP Inspection: Separate 3D Metrology from 2D Defect Review HBM and WLP Inspection: Separate 3D Metrology from 2D Defect Review

HBM and WLP Inspection: Separate 3D Metrology from 2D Defect Review

Why 3D height metrology and 2D defect review need separate optical chains in HBM and WLP lines, with NA, sampling and depth-of-field arithmetic.

Glass Core TGV Inspection: Surface AOI vs Subsurface Crack Detection Glass Core TGV Inspection: Surface AOI vs Subsurface Crack Detection

Glass Core TGV Inspection: Surface AOI vs Subsurface Crack Detection

Why a visible-light AOI station and a 1200-1800 nm crack system stay separate tools, with field arithmetic for TGV panels, ABF build-up and via taper.

Flash Measurement System for PCB Inspection Flash Measurement System for PCB Inspection

Flash Measurement System for PCB Inspection

Single-exposure PCB measurement: which board sizes fit a 300 x 200 mm field, why repeatability is not accuracy, and where AOI takes over.

Zoom Lens for Machined Parts: One Camera, Several Magnifications Zoom Lens for Machined Parts: One Camera, Several Magnifications

Zoom Lens for Machined Parts: One Camera, Several Magnifications

How a motorized zoom lens covers machined part families: sizing magnification from the part envelope, stand-off in the enclosure and depth of field versus feature height.

Flash Measurement System for Semiconductor Wafer Inspection Flash Measurement System for Semiconductor Wafer Inspection

Flash Measurement System for Semiconductor Wafer Inspection

Single-field flash measurement on wafers: dual-magnification telecentric optics, field calibration, the 0.02L accuracy term, and where a 300 mm wafer stops fitting.

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