When a camera optical station earns its place beside a robot arm: uncertainty budget, depth of field, cycle time and interface ownership.
Why 3D height metrology and 2D defect review need separate optical chains in HBM and WLP lines, with NA, sampling and depth-of-field arithmetic.
Why a visible-light AOI station and a 1200-1800 nm crack system stay separate tools, with field arithmetic for TGV panels, ABF build-up and via taper.
Single-exposure PCB measurement: which board sizes fit a 300 x 200 mm field, why repeatability is not accuracy, and where AOI takes over.
How a motorized zoom lens covers machined part families: sizing magnification from the part envelope, stand-off in the enclosure and depth of field versus feature height.
Single-field flash measurement on wafers: dual-magnification telecentric optics, field calibration, the 0.02L accuracy term, and where a 300 mm wafer stops fitting.
How to size a zoom lens for EV battery weld inspection: turning seam width into FOV, 6.5X and 12.5X working distance, depth of field, and RS-232 recipe switching.
Telecentric optics keep magnification constant across wafer, chip and package inspection. See verified POMEAS specs, magnification selection and coaxial lighting options.
What an image dimension measurement system is, how the POMEAS IMAGE 3 series is specified, and how to pick the right model by range, repeatability and height measurement.
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