Robotic At-Line Metrology: When to Add a Camera-Based Optical Station Robotic At-Line Metrology: When to Add a Camera-Based Optical Station

Robotic At-Line Metrology: When to Add a Camera-Based Optical Station

When a camera optical station earns its place beside a robot arm: uncertainty budget, depth of field, cycle time and interface ownership.

HBM and WLP Inspection: Separate 3D Metrology from 2D Defect Review HBM and WLP Inspection: Separate 3D Metrology from 2D Defect Review

HBM and WLP Inspection: Separate 3D Metrology from 2D Defect Review

Why 3D height metrology and 2D defect review need separate optical chains in HBM and WLP lines, with NA, sampling and depth-of-field arithmetic.

Glass Core TGV Inspection: Surface AOI vs Subsurface Crack Detection Glass Core TGV Inspection: Surface AOI vs Subsurface Crack Detection

Glass Core TGV Inspection: Surface AOI vs Subsurface Crack Detection

Why a visible-light AOI station and a 1200-1800 nm crack system stay separate tools, with field arithmetic for TGV panels, ABF build-up and via taper.

Flash Measurement System for PCB Inspection Flash Measurement System for PCB Inspection

Flash Measurement System for PCB Inspection

Single-exposure PCB measurement: which board sizes fit a 300 x 200 mm field, why repeatability is not accuracy, and where AOI takes over.

Zoom Lens for Machined Parts: One Camera, Several Magnifications Zoom Lens for Machined Parts: One Camera, Several Magnifications

Zoom Lens for Machined Parts: One Camera, Several Magnifications

How a motorized zoom lens covers machined part families: sizing magnification from the part envelope, stand-off in the enclosure and depth of field versus feature height.

Flash Measurement System for Semiconductor Wafer Inspection Flash Measurement System for Semiconductor Wafer Inspection

Flash Measurement System for Semiconductor Wafer Inspection

Single-field flash measurement on wafers: dual-magnification telecentric optics, field calibration, the 0.02L accuracy term, and where a 300 mm wafer stops fitting.

Zoom Lens for EV Battery Weld Inspection: FOV and Magnification Zoom Lens for EV Battery Weld Inspection: FOV and Magnification

Zoom Lens for EV Battery Weld Inspection: FOV and Magnification

How to size a zoom lens for EV battery weld inspection: turning seam width into FOV, 6.5X and 12.5X working distance, depth of field, and RS-232 recipe switching.

Telecentric Lenses for Semiconductor Inspection: Model Selection by the Numbers Telecentric Lenses for Semiconductor Inspection: Model Selection by the Numbers

Telecentric Lenses for Semiconductor Inspection: Model Selection by the Numbers

Telecentric optics keep magnification constant across wafer, chip and package inspection. See verified POMEAS specs, magnification selection and coaxial lighting options.

Image Dimension Measurement System | IMAGE 3 Guide Image Dimension Measurement System | IMAGE 3 Guide

Image Dimension Measurement System | IMAGE 3 Guide

What an image dimension measurement system is, how the POMEAS IMAGE 3 series is specified, and how to pick the right model by range, repeatability and height measurement.

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